Electroless copper plating on liquid crystal polymer (LCP): Top LECS process
Plating treatment for LCP film with excellent high-frequency characteristics and dielectric properties! Development of a process that combines surface modification ensuring high adhesion and electroless plating.
Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices even in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluoropolymer resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) has excellent electrical properties in the high-frequency range, low moisture absorption, and superior dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to be difficult to achieve with copper plating.
- 企業：奥野製薬工業 大阪・放出、東京、名古屋など
- 価格：Other
